Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2000-05-11
2004-01-13
Abrams, Neil (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S953000, C439S329000, C439S353000, C361S803000
Reexamination Certificate
active
06676416
ABSTRACT:
TECHNICAL FIELD
The present invention relates in general to mechanisms for electrically coupling two components, and in specific to a ribbon cable, an electrical connector, and a temporarily engageable/disengageable mechanism for electrically coupling microcomponents.
BACKGROUND
Extraordinary advances are being made in microelectronic devices and MicroElectroMechanical (“MEM”) devices, which comprise integrated micromechanical and microelectronic devices. The terms “microcomponent” and “microdevice” will be used herein generically to encompass microelectronic components, as well as MEMs components. A need exists in the prior art for a mechanism for electrically coupling microcomponents.
In the prior art, integrated circuits (“ICs”) are commonly implemented with a microcomponent (e.g., a MEMs component) hard wired to a bond pad (e.g., with electrical traces on the circuit). That is, the wiring electrically coupling microcomponents within an IC of the prior art is physically attached to the substrate and is not releasable therefrom. To electrically couple the microcomponents of one IC to those of another IC, for example, external wires are coupled from one IC to the bond pads of another IC. The bond pads provide a connection point for a wire typically 25 microns in diameter. A solder bump may be utilized, which is a ball of solder that is about 75 microns in diameter. Turning to
FIG. 10
, an example of such a prior art implementation is shown. In
FIG. 10
, a one centimeter die site
10
(which may be referred to as a “chip”) is implemented having one or more MEMs components
12
included thereon. It should be understood that the die site may be any of various sizes commonly implemented in the prior art, but for illustrative purposes, a one centimeter die site is described in conjunction with FIG.
10
. As further shown, the die site
10
includes bond pads
14
, which are each typically approximately 50 to 100 microns in size. The MEMs components
12
are “hard wired” to the bond pads
14
with electrical traces
16
. Thereafter, the MEMs components
12
may be electrically coupled to off-chip devices (i.e., devices off die site
10
) through coupling wires to the appropriate bond pads.
As is well known in the prior art, the chip
10
is typically placed in a “chip carrier,” which is the package for the chip. Thus, the entire one centimeter die
10
is placed in a package which provides wires to the outside world. Typically, a machine called a “wire bonder” connects each pad of the chip
10
to an appropriate pin on the package using wires
18
. Wires
18
are each approximately 25 microns in size. Given that a MEMs component may be only 100 microns (or smaller) in size, the external wires
18
used to couple the bond pads to a pin on the package are relatively large in comparison with MEMs components
12
.
The above-described prior art technique of coupling MEMs components of a chip to off-chip devices has many characteristics that are often undesirable in implementing MEMs components. First, the individual MEMs components are permanently hard-wired in a manner that does not permit the individual MEMs components to move (e.g., rotate and/or translate along a path) as may be desired for some implementations. Additionally, a disproportionately large amount of area is consumed by the wiring for coupling the MEMs components. For example, each external wire
18
of
FIG. 10
is approximately 25 microns in size, wherein an individual MEM component
12
may be 100 microns (or less) in size. Accordingly, the wiring required for coupling the MEMs components to off-chip devices may consume more area than is required for the MEMs components themselves. As a result, the prior art technique of coupling microcomponents (e.g., MEMs components) does not allow for individual components to be electrically coupled to other devices in a flexible manner such that the components may maintain an electrical coupling as the components move (e.g., rotate and/or translate in some direction) relative to each other. Furthermore, the prior art technique of coupling microcomponents does not allow for individual components to be temporarily electrically coupled to another component in a manner such that the components may be electrically engaged for a period of time and then electrically disengaged for a period of time.
SUMMARY OF THE INVENTION
In view of the above, a desire exists for an electrical coupling mechanism suitable for electrically coupling microcomponents. A further desire exists for a relatively small-scale electrical coupling mechanism that is not disproportionately large in relation to the microcomponents being coupled. Still a further desire exists for a flexible electrical coupling mechanism that is capable of adapting to various positions to enable microcomponents to be flexibly coupled. For example, a desire exists for a flexible electrical coupling mechanism that enables microcomponents to maintain an electrical coupling as the components move (e.g., rotate and/or translate in some direction) relative to each other. Yet a further desire exists for an electrical coupling mechanism that enables individual components to be electrically engaged for a period of time and then electrically disengaged for a period of time. That is, a desire exists for an electrical coupling mechanism that may be utilized to engage and disengage a component to provide an electrical coupling in a desirable manner.
These and other objects, features and technical advantages are achieved by a system, apparatus, and method which enable microcomponents to be electrically coupled in a desirable manner. More specifically, electrical coupling mechanisms are disclosed, which are suitable for providing an electrical coupling between two or more microcomponents. One electrical coupling mechanism provided herein, which may be utilized to provide a flexible coupling between two or more microcomponents, is a ribbon cable. Such a ribbon cable may include one or more electrically isolated conducting “rows,” which may enable communication of electrical signals between two or more microcomponents coupled to such ribbon cable. An electrical connector is also provided herein, which is suitable for electrically coupling two or more microcomponents. Such an electrical connector may be utilized to couple a ribbon cable to a microcomponent or it may be utilized to directly couple two microcomponents in a manner that enables electrical communication therebetween. Furthermore, a “Z clamp” electrical connector is provided which allows for an engageable/disengageable electrical connection to be achieved between two or more microcomponents.
The electrical coupling mechanisms of the present invention may be integrated within a microcomponent to enable the microcomponent to be electrically coupled to another microcomponent. For example, a MEMs component may be fabricated having an electrical connector (e.g., ribbon cable, connector, and/or Z clamp connector) included therewith to enable the MEMs component to obtain a desired electrical coupling to one or more other MEMs components. Furthermore, the electrical coupling mechanisms may be implemented as an integrated part between two or more microcomponents. For example, two or more MEMs components may be fabricated having an electrical coupling mechanism as an integrated component that electrically couples such two or more components. Alternatively, the electrical coupling mechanisms of the present invention may be implemented as stand-alone mechanisms that may then be used to provide a desired electrical coupling between two or more microcomponents.
The electrical coupling mechanisms of the present invention may be fabricated utilizing any of various fabrication techniques, including, as examples, those fabrication processes disclosed in U.S. Pat. No. 4,740,410 issued to Muller et al. entitled “MICROMECHANICAL ELEMENTS AND METHODS FOR THEIR FABRICATION,” U.S. Pat. No. 5,660,680 issued to Chris Keller entitled “METHOD FOR FABRICATION OF HIGH VERTICAL ASPECT RATIO THIN FILM STRUCTURES.” U.S. Pat
Ellis Matthew D.
Skidmore George D.
Abrams Neil
Haynes and Boone LLP
Zyvex Corporation
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