Ribbon, bonding wire and microwave circuit package

Details Ribbon, bonding wire and microwave circuit package Ribbon, bonding wire and microwave circuit package

1997-04-22

1999-08-10

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

257692, 333260, 361772, H01P 500

Patent

active

059364920

ABSTRACT:
A ribbon and a bonding wire are connected respectively to a high-frequency input and output of a microwave circuit, the width of the ribbon and/or the thickness of the bonding wire being varied continuously or discontinuously at a portion other than a portion used for bonding. By applying the ribbon and bonding wire to a microwave circuit package including a metallic substrate and sealing therein an MMIC mounted to the metallic substrate, desired high-frequency characteristics of the MMIC can be obtained.

REFERENCES:
patent: 4600907 (1986-07-01), Grellman et al.
patent: 4967261 (1990-10-01), Niki et al.
patent: 5086335 (1992-02-01), Leibovitz et al.
patent: 5359227 (1994-10-01), Liang et al.
patent: 5438305 (1995-08-01), Hikita et al.
patent: 5491302 (1996-02-01), Distefano et al.
patent: 5508563 (1996-04-01), Tazawa et al.
patent: 5736784 (1998-04-01), Dove
patent: 5821457 (1998-10-01), Mosley et al.

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