Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2011-07-19
2011-07-19
Kornakov, Michael (Department: 1714)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C134S004000, C134S010000, C134S042000, C252S06251C, C252S073000, C451S035000, C451S038000, C204S242000
Reexamination Certificate
active
07981221
ABSTRACT:
Methods and apparatus for cleaning a substrate (e.g., wafer) in the fabrication of semiconductor devices utilizing electrorheological (ER) and magnetorheological (MR) fluids to remove contaminant residual particles from the substrate surface are provided.
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Kornakov Michael
Micro)n Technology, Inc.
Whatley Katelyn B
Whyte Hirschboeck Dudek SC
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