Rheological fluids for particle removal

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

Reexamination Certificate

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C134S004000, C134S010000, C134S042000, C252S06251C, C252S073000, C451S035000, C451S038000, C204S242000

Reexamination Certificate

active

07981221

ABSTRACT:
Methods and apparatus for cleaning a substrate (e.g., wafer) in the fabrication of semiconductor devices utilizing electrorheological (ER) and magnetorheological (MR) fluids to remove contaminant residual particles from the substrate surface are provided.

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