Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-03-20
2009-12-08
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
With measuring or testing
C438S015000, C438S017000, C438S530000, C257SE21051, C257SE21053, C257SE21091, C257SE21324, C257SE21632
Reexamination Certificate
active
07629184
ABSTRACT:
A method of manufacturing semiconductor wafers is provided that comprises processing a semiconductor wafer to form at least one temperature-sensing RF device on the wafer and further processing the wafer to form a plurality of semiconductor products on the wafer while sensing temperature on the wafer with the formed RF device and wirelessly transmitting data from the RF device. Semiconductor wafers made according to the method are provided having at least one active RFID temperature-sensing device and semiconductor device products formed thereon. The RFID devices are located on portions of the wafer that are disposable when the semiconductor device products are cut from the wafers. A semiconductor wafer processing apparatus is provided having an RF antenna and transmitter and receiver circuits that communicate with RF devices on a wafer during processing.
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Lebentritt Michael S
Tokyo Electron Limited
Wood Herron & Evans L.L.P.
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