Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-05-31
2011-05-31
Koch, III, George R (Department: 1745)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S233000, C156S252000, C156S256000
Reexamination Certificate
active
07951249
ABSTRACT:
The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.
REFERENCES:
patent: 5867102 (1999-02-01), Souder et al.
patent: 6100804 (2000-08-01), Brady et al.
patent: 6147604 (2000-11-01), Wiklof et al.
patent: 6215401 (2001-04-01), Brady et al.
patent: 6265977 (2001-07-01), Vega et al.
patent: 6294998 (2001-09-01), Adams et al.
patent: 6424315 (2002-07-01), Glenn et al.
patent: 6451154 (2002-09-01), Grabau et al.
patent: 2004/0074974 (2004-04-01), Senba et al.
patent: 11-067993 (1999-03-01), None
patent: 2001-024107 (2001-01-01), None
patent: 2001-109869 (2001-04-01), None
patent: 2001-160606 (2001-06-01), None
patent: 2002-525726 (2002-08-01), None
patent: 2004-079949 (2004-03-01), None
patent: WO 00/16286 (2000-03-01), None
Japanese Office Action dated Nov. 2, 2010, issued in corresponding Japanese Patent Application No. 2004-364590. (partial translation).
Aoki Michimasa
Kikuchi Shunichi
Suzuki Masumi
Fujitsu Limited
Koch, III George R
Westerman Hattori Daniels & Adrian LLP
LandOfFree
RFID tag does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with RFID tag, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and RFID tag will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2708162