RFID device and method of forming

Details RFID device and method of forming RFID device and method of forming

2007-05-23

2011-12-06

Wu, Daniel (Department: 2612)

Communications: electrical

Condition responsive indicating system

Specific condition

C340S572100, C340S572400, C340S572800, C235S492000, C343S702000, C029S829000

Reexamination Certificate

active

08072333

ABSTRACT:
A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.

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Wernle, Michael E. Dr., “Manufacturing of Low Cost Smart Labels”, NanoPierce Card Technologies GmbH, presented at IMAPS, Boston Massachusetts, Sep. 2000.

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