RF shielded device

Details RF shielded device RF shielded device

1998-05-22

2000-11-21

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438 33, 438112, 438124, 438126, 438127, H01L 2144

Patent

active

06150193&

ABSTRACT:
A shielded package for an IC chip having bond pads thereon includes an insulating substrate having metallizations formed on a surface of the substrate. The IC chip is mounted to the substrate surface and the IC chip bonding pads are electrically coupled to corresponding substrate metallizations. An insulating encapsulant layer encapsulates the IC chip and the substrate surface. A conductive shield layer comprising a cured flowable electrically conductive material is formed above the encapsulant layer.
The encapsulant layer electrically isolates the shield layer from the IC chip and the various electrical conductors (e.g. bonding pads, bond wires, contacts and metallizations). The shield layer, being an electrically conductive material, forms a floating ground plane which shields the IC chip and the remainder of the package. Thus, the shield layer prevents external radiation form interfering with the operation of the package and also prevents the package from emitting radiation which could interfere with other electronic components and devices.

REFERENCES:
patent: 4508758 (1985-04-01), Wong
patent: 4530152 (1985-07-01), Roche et al.
patent: 4768081 (1988-08-01), Moeller
patent: 4890383 (1990-01-01), Lumbard et al.
patent: 5087961 (1992-02-01), Long et al.
patent: 5102829 (1992-04-01), Cohn
patent: 5126818 (1992-06-01), Takami et al.
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5227663 (1993-07-01), Patil et al.
patent: 5239198 (1993-08-01), Lin et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5250470 (1993-10-01), Yamaguchi
patent: 5258650 (1993-11-01), Polak et al.
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5386342 (1995-01-01), Rostoker
patent: 5397746 (1995-03-01), Blish, III
patent: 5436203 (1995-07-01), Lin
patent: 5468999 (1995-11-01), Lin et al.
patent: 5473512 (1995-12-01), Degani et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5489059 (1996-02-01), Rostoker et al.
patent: 5578525 (1996-11-01), Mizukoshi
patent: 5593926 (1997-01-01), Fujihara
patent: 5596485 (1997-01-01), Glenn et al.
patent: 5600181 (1997-02-01), Scott et al.
patent: 5612513 (1997-03-01), Tuttle et al.
patent: 5639989 (1997-06-01), Higgins, III
patent: 5700981 (1997-12-01), Tuttle et al.
patent: 5719440 (1998-02-01), Moden
patent: 5767447 (1998-06-01), Dudderar et al.
patent: 5776798 (1998-07-01), Quan et al.
patent: 5973263 (1999-10-01), Tuttle et al.
patent: 5973337 (1999-10-01), Knapp et al.
patent: 5981314 (1999-11-01), Glenn et al.
patent: 5990545 (1999-10-01), Schueller et al.
Banerji, K., "Development of the Slightly Larger Than IC Carrier (SLICC)", Proceedings of the Feb. 27-Mar. 4, 1994, Technical Program NEPCON WEST '94, pp. 1249-1256.
Levine, B. and Guinther, F., "The Package", Electronic News vol. 42, No. 2112 (1996), pp. 1, 32.

Affiliated with

Also associated with

Rating

RF shielded device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with RF shielded device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and RF shielded device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1255838