RF shielded and electrically insulated circuit board structure a

Details RF shielded and electrically insulated circuit board structure a RF shielded and electrically insulated circuit board structure a

1987-01-30

1989-08-15

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174DIG8, H05K 114

Patent

active

048580759

ABSTRACT:
An RF shielded and electrically insulated circuit board structure comprises a first layer of shrink wrap tubing wrapped on a circuit board substrate, and a layer of an electrically conductive RF shielding material on the tubing. A second layer of shrink wrap tubing retains the electrically conductive material to the circuit board. Edge portions of the electrically conductive layer and heat shrink tubing are folded inward to prevent RF energy from the circuit board from leaking from the edges of the structure. The structure is made by wrapping a first heat shrink tubing on the circuit board to insulate and seal any wiring patterns and components thereon and shrinking the tubing by applying heat. The electrically conductive layer is located on the heat shrink tubing, and the second heat shrink tubing is wrapped on the electrically conductive layer and first tubing. Heat is applied to shrink the second tubing, and, with circuit wiring extending outward, the edge portions of the structure are folded inward to complete the structure.

REFERENCES:
patent: 2861911 (1958-11-01), Martin et al.
patent: 3754311 (1973-08-01), Rayburn
patent: 3980382 (1976-07-01), Reeder
patent: 4144438 (1979-03-01), Gelman et al.
patent: 4370518 (1983-01-01), Guzy
patent: 4487994 (1984-12-01), Bahder
patent: 4555422 (1985-11-01), Nakamura et al.
patent: 4598165 (1986-07-01), Tsai
patent: 4695926 (1987-09-01), McDermott

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