RF seal ring structure

Details RF seal ring structure RF seal ring structure

2005-09-13

2005-09-13

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C257S758000, C257S759000, C257S760000

Reexamination Certificate

active

06943063

ABSTRACT:
Described is a method where a seal ring is formed by stacking interconnected conductive layers along the perimeter of an integrated circuit (IC). The seal ring is formed continuously around the IC perimeter using a conductive chain with two distinct widths. Each section of distinct width forms a transmission having a distinct characteristic impedance. Unwanted signals may be coupled to the seal ring from signal bond pads or from internal circuitry. Because of the impedance mismatch between the different width sections of the seal ring transmission lines, only a portion of each signal is propagated through each seal ring discontinuity while the remainder is reflected. As the signal passes through multiple discontinuities in the seal ring, it is further attenuated, reducing propagation of unwanted signals. This is accomplished while preventing moisture intrusion into the IC.

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