RF printed circuit module and method of making same

Details RF printed circuit module and method of making same RF printed circuit module and method of making same

1996-03-13

1997-12-30

Pascal, Robert

Wave transmission lines and networks

Coupling networks

Frequency domain filters utilizing only lumped parameters

29593, 333204, H03H 701, G01R 2704

Patent

active

057035440

ABSTRACT:
The present invention discloses an RF printed circuit module and the method of making it. The RF printed circuit module includes a first single-clad sheet having a dielectric layer and a metal layer attached to a top surface thereof, a second single-clad sheet having a dielectric layer and a metal layer attached to a bottom surface thereof, and a double-clad sheet having a dielectric layer with a first metal layer attached to a top surface and a second metal layer attached to a bottom surface, wherein the double-clad sheet is positioned between and attached to the first and second single-clad sheets. The first and second metal layers of the double-clad sheet are etched to form desired lumped and distributed circuit elements thereon. The metal layers of the first and second single-clad sheets are etched to provide ground planes and portions of external terminals for the RF printed circuit module. The RF printed circuit module is edge-plated along the perimeter thereof to connect the metal layers of the first and second single-clad sheets, with a portion of such edge-plating being removed on one side of the RF printed circuit module to form a pair of external terminals to permit electrical connection thereto by a surface mounting arrangement.

REFERENCES:
patent: 3701958 (1972-10-01), Jaag
patent: 4063201 (1977-12-01), Komatsubara et al.
patent: 4758922 (1988-07-01), Ishigaki et al.
patent: 4916417 (1990-04-01), Ishikawa et al.
patent: 5032803 (1991-07-01), Koch
patent: 5237296 (1993-08-01), Mandai et al.
patent: 5300903 (1994-04-01), Okamura et al.
patent: 5448209 (1995-09-01), Hirai et al.
patent: 5493769 (1996-02-01), Sakai et al.

Affiliated with

Also associated with

Rating

RF printed circuit module and method of making same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with RF printed circuit module and method of making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and RF printed circuit module and method of making same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-206437