RF power transistor having improved stability and gain

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Including passive device

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438330, 438309, 438324, 438329, 438338, 438342, H01L 21328

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active

058693815

ABSTRACT:
Increased gain and improved stability are realized in using resistive emitter ballasting by including integrated capacitive elements in parallel with the resistive elements in the emitter circuit. A feature of the invention is an integrated capacitor structure having a small surface area to minimize parasitic capacitance, whereby resistor and capacitor surface areas of 100 square micrometers or less are obtained. Another feature of the invention is the use of a high dielectric material in realizing a resistor-capacitor impedance zero at a frequency much lower than the operating frequency of the transistor. For an operating frequency of 2 GHz and resistor values of 50-250 ohms, capacitance required is 3 pF or greater. Another feature of the invention is a method of fabricating the integrated resistive-capacitive element in either a low temperature process or a high temperature process which minimizes capacitor leakage when using a thin high dielectric insulative material between capacitor plates.

REFERENCES:
patent: 5374844 (1994-12-01), Moyer
patent: 5455449 (1995-10-01), Inn
patent: 5488252 (1996-01-01), Johansson et al.
patent: 5567964 (1996-10-01), Kashihara et al.
patent: 5629648 (1997-05-01), Pratt
patent: 5716506 (1998-02-01), Maclay et al.
Wolf Stanley, Silicon Processing for the VLSI Era, vol. 1, p. 520, 1990.

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