RF power transistor having an encapsulated chip package

Details RF power transistor having an encapsulated chip package RF power transistor having an encapsulated chip package

2006-06-27

2009-10-20

Gurley, Lynne A. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S670000, C257S676000, C257SE23043

Reexamination Certificate

active

07605451

ABSTRACT:
In various embodiments, semiconductor components and methods to manufacture semiconductor components are disclosed. In one embodiment, a method to manufacture semiconductor components includes attaching multiple heat spreaders to a semiconductor wafer. Other embodiments are described and claimed.

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