Wave transmission lines and networks – Long line elements and components – Strip type
Patent
1998-01-28
2000-02-22
Gensler, Paul
Wave transmission lines and networks
Long line elements and components
Strip type
257698, 257728, 333 26, 333260, 439 63, H01P 100
Patent
active
060284978
ABSTRACT:
A hermetic RF pin grid array package methodology is described that obviates the need for glass to metal feedthroughs, simplifying construction, improving reliability and reducing the cost of RF multi-chip modules. An array of cylindrical passages (13, 15) through the module's base plate (3) are aligned with and receive respective associated conductor pins (7, 9) depending from the module substrate (1). Cylindrical metal shrouds (11) are positioned within some passages (15) combine with associated pins (9) to define coaxial RF transmission lines and support for an external RF coax coupling. Unshrouded pins (7) serve to connect DC to the integrated circuit chips in the module. Waveguide interfaces, if required, are provided by conductive coupling structures patterned on the substrate, suspended over a waveguide (17) formed in or about the baseplate. The compartmentalized seal ring (5) attached to the top surface of the substrate provides a metal framework that divides the interior area, providing individual compartment for the distinct RF circuits in the module, including the integrated circuit chips associated with each such RF circuit.
REFERENCES:
patent: 5045820 (1991-09-01), Leicht et al.
patent: 5202648 (1993-04-01), McCandless
patent: 5266912 (1993-11-01), Kledzik
patent: 5668408 (1997-09-01), Nicholson
Allen Barry R.
Dair Edwin D.
Duprey Randy J.
Gensler Paul
Goldman Ronald M.
TRW Inc.
Yatsko Michael S.
LandOfFree
RF pin grid array does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with RF pin grid array, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and RF pin grid array will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-523731