RF package

Details RF package RF package

2007-03-06

2007-03-06

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Strip type

C333S033000, C333S246000, C333S238000

Reexamination Certificate

active

10782179

ABSTRACT:
A novel package includes a substrate including an upper surface ground plane connected to a lower surface ground plane by vias through the substrate, a die located on the upper ground plane and including a die pad, a transmission path including, on the upper surface of the substrate, a bonding pad connected to a first transmission line itself connected to a transition pad, and on the lower surface of the substrate, a second transmission line connected to the transition pad by a via through the substrate. A wire bond extends from the bonding pad to the die pad. A portion of the upper surface ground plane and the lower surface ground plane are connected by vias defining opposing walls on either side of the transmission path for signal isolation. A low pass filter for compensating wire bond inductance includes: a first capacitance formed between the bonding pad and at least the lower surface ground plane, the wire bond inductance, and a second capacitance formed between the die pad and at least the upper surface ground plane.

REFERENCES:
patent: 5014115 (1991-05-01), Moser
patent: 5023624 (1991-06-01), Heckaman et al.
patent: 5057805 (1991-10-01), Kadowaki
patent: 5162822 (1992-11-01), Wakamori
patent: 5270673 (1993-12-01), Fries et al.
patent: 5294897 (1994-03-01), Notani et al.
patent: 5307237 (1994-04-01), Walz
patent: 5389904 (1995-02-01), Tao et al.
patent: 5406125 (1995-04-01), Johnson et al.
patent: 5477137 (1995-12-01), Staudinger et al.
patent: 5528074 (1996-06-01), Goto et al.
patent: 5583468 (1996-12-01), Kielmeyer et al.
patent: 5602421 (1997-02-01), Li
patent: 5917388 (1999-06-01), Tronche et al.
patent: 5982250 (1999-11-01), Hung et al.
patent: 6201454 (2001-03-01), Kinayman et al.
patent: 6294966 (2001-09-01), Huang et al.
patent: 6426686 (2002-07-01), Douriet et al.
patent: 6538336 (2003-03-01), Secker et al.
patent: 6646521 (2003-11-01), Huang
patent: 6759742 (2004-07-01), Budka
patent: 6873230 (2005-03-01), Shirasaki

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