RF module package for releasing stress

Details RF module package for releasing stress RF module package for releasing stress

2011-03-22

2011-03-22

Sefer, A. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S706000, C257S723000, C257S782000, C257SE33075, C257SE23051

Reexamination Certificate

active

07911044

ABSTRACT:
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the die; a protection layer formed over the RDL; and pluralities of pads formed on the protection layer and coupled to the RDL. The RDL is made from an alloy comprising Ti/Cu/Au alloy or Ti/Cu/Ni/Au alloy.

REFERENCES:
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patent: 2002/0070443 (2002-06-01), Mu et al.
patent: 2005/0062147 (2005-03-01), Wakisaka et al.
patent: 2005/0121770 (2005-06-01), Baek et al.
patent: 2005/0212107 (2005-09-01), Kato
patent: 2006/0087037 (2006-04-01), Hsu
patent: 2007/0138603 (2007-06-01), Lam
patent: 2007/0166551 (2007-07-01), Lin
patent: 2007/0187836 (2007-08-01), Lyne
patent: 2008/0116564 (2008-05-01), Yang et al.
patent: 2008/0157340 (2008-07-01), Yang et al.

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