RF module

Details RF module RF module

2007-07-17

2007-07-17

Bui, Bing Q. (Department: 2614)

Telecommunications

Transmitter and receiver at same station

Having particular housing or support of a transceiver

C455S073000

Reexamination Certificate

active

09884274

ABSTRACT:
An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A metallic cap also is attached to the upper surface of the multi-layered substrate. A cavity is formed in the lower surface of the multi-layered substrate substantially at the center thereof. A first RF-IC and a second RF-IC are embedded in the cavity. Wiring patterns for providing connections between the base-band IC and the memory IC, through-holes, RF passive components, and the shield ground electrode pattern are disposed inside of the multi-layered substrate.

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Translation of Official Communication filed in corresponding Finnish Paten Application No. 2001-1247, dated Dec. 30, 2005.

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