RF module

Details RF module RF module

2011-08-16

2011-08-16

Jones, Stephen E (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Strip type

C333S245000

Reexamination Certificate

active

07999640

ABSTRACT:
In a radio-frequency wave module including a transmission path based on a distributed parameter element, the transmission path being part of an input/output terminal, a plurality of cavity-structured concave portions for containing semiconductor-including mounted components therein, grounding-use metallic electrodes, dielectric substrates of at least two or more layers, and semiconductors, electrical separation is established between the grounding-use metallic electrodes which form the transmission paths based on the distributed parameter element and at least one of the grounding-use metallic electrodes which are formed on bottom surfaces of the plurality of cavity-structured concave portions for containing the semiconductor-including mounted components therein.

REFERENCES:
patent: 2008/0186112 (2008-08-01), Hase
60GHz-Band Flip-Chip MMIC Modules for IEEE1394 Wireless Adapters, K. Murahashi, et al.
RF and Microwave Packaging Technology, Dielectric Laboratories in Mar. 2003.

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