RF/microwave system with a system on a chip package or the like

Details RF/microwave system with a system on a chip package or the like RF/microwave system with a system on a chip package or the like

2008-06-03

2008-06-03

Le, Danh (Department: 2617)

Telecommunications

Transmitter and receiver at same station

Radiotelephone equipment detail

C455S333000, C455S090300, C257S098000, C257S099000

Reexamination Certificate

active

07383058

ABSTRACT:
A transceiver system on a single package provides an RF/Microwave subsystem in an area external to the processor die which contains a digital processor. The external area may include an antenna-switch, an input matching network and an impedance transformer impedance transformer and RF-choke for a power amplifier as the passive elements to provide both lower noise reception and higher efficiency transmission.

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L.M. Franca-Neto et al., Enabling High-Performance Mixed-Signal System-on-a-Chip (SoC) in a High Performance Logic CMOS Technology, Intel Corporation, 4 pps., Jul. 2002.
L.M. Franca-Neto, “System-on-a-package (SoP) Solution for High Performance RF/Microwave Systems”, Wireless Technology Lab; Intel Corporation, 1 page, Jul. 2002.

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