RF IC package

Details RF IC package RF IC package

1997-07-18

1999-02-09

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257685, 257686, 257777, 257778, 257728, H01L 2334, H01L 2302, H01L 2348, H01L 2352

Patent

active

058698949

ABSTRACT:
The specification describes a MCM IC package with improved RF grounding. The package has at least one RF IC chip bonded to an interconnect substrate and the substrate is interconnected to an intermediate printed wiring board (IPWB). The IPWB is interconnected in turn to a system printed wiring board (SPWB). The RF IC chip is metallized on the backside, and is flip chip bonded directly to the SPWB thereby eliminating two intermediate interconnections and reducing the impedance of the interconnection between the RF chip and the SWBP.

REFERENCES:
patent: 5198963 (1993-03-01), Gupta et al.
patent: 5608262 (1997-03-01), Degani et al.
patent: 5646828 (1997-07-01), Degani et al.

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