RF filter having composite dielectric layer and method of manufa

Details RF filter having composite dielectric layer and method of manufa RF filter having composite dielectric layer and method of manufa

1993-01-22

1995-01-17

Ham, Seungsook

Wave transmission lines and networks

Coupling networks

Frequency domain filters utilizing only lumped parameters

333184, 295921, H03H 701

Patent

active

053829280

ABSTRACT:
A distributed element filter member (10) comprises a semi-conductor member (12) having a composite dielectric layer (24) disposed on and secured to a first major surface (16) of the member (12), the layer (24) being comprised of a polymerized dielectric material made of either barium titanate or strontium titanate particles in various ranges of mixture; a conductive layer (34) is disposed on portions of the dielectric layer defining an outer ground conductor and an inner conductive layer (36) is disposed on a second major surface of the semi-conductor member defining a signal conductor. The polymer utilized may be selected from an aqueous solution containing acrylic styrene as a copolymer or a solid polyester dissolved in carbitol acetate, or a solid bisphenol A-based epoxy resin dissolved in butyl carbitol acetate with various mixtures of barium or strontium titanate utilized. A filter (12') embodiment includes three layers of polymerized material.

REFERENCES:
patent: Re29258 (1975-01-01), Fritz
patent: 2843541 (1956-05-01), Senderoff et al.
patent: 3613033 (1971-10-01), Denes
patent: 3638147 (1972-01-01), Denes
patent: 3743978 (1973-07-01), Fritz
patent: 3789263 (1974-01-01), Fritz et al.
patent: 4555745 (1985-11-01), Westermeir et al.
patent: 4584074 (1986-04-01), Sterling et al.
patent: 4734663 (1986-10-01), Focht
patent: 4791391 (1988-12-01), Linnell et al.
patent: 4853659 (1988-03-01), Kling
patent: 4853827 (1989-08-01), Hernandez
patent: 4931754 (1990-06-01), Moussie
European Search Report (three pages), Apr. 15, 1994.

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