Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent
1997-10-01
2000-04-04
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
257728, 333247, H01L 2304, H01L 2334
Patent
active
060465018
ABSTRACT:
An RF-driven semiconductor chip is die-bonded to the top face of a metal plate. The semiconductor chip and the metal plate are molded together with outer leads in a plastic package in the form of a rectangular parallelepiped. The metal plate is exposed at the back face of the plastic package. The metal plate is not protruding from the front and rear side faces of the plastic package. The front and rear side faces of the metal plate are flush with the front and rear side faces of the plastic package and partially exposed at the front and rear side faces of the plastic package. The front and rear portions of the plastic package are centrally formed with respective cutaway portions each in the form of a rectangular parallelepiped. The top face of the metal plate is exposed in the cutaway portions formed centrally in the front and rear portions of the plastic package to form solder portions.
REFERENCES:
patent: 4706105 (1987-11-01), Masuda et al.
patent: 4994897 (1991-02-01), Golubic et al.
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5445995 (1995-08-01), Casati et al.
T. Kawai, Mobile Communication Device Using MMIC Technology:, SPECIAL: Semiconductor in Fujitsu, vo. 47, No. 5, pp. 398-402, Sep. 1996, together with a partial English translation thereof.
Fujiwara Toshio
Ishikawa Osamu
Itoh Junji
Kunihisa Taketo
Muramatsu Kaoru
Arroyo Teresa M.
Matsushita Electric - Industrial Co., Ltd.
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