RF device package for high frequency applications

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

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Details

257676, 257774, 257775, H01L 23495, H01L 2348, H01L 2352

Patent

active

056635974

ABSTRACT:
This is a device package comprising: a leadframe comprising a plurality of leads for effecting circuit connections to the device; and a metal ground piece connected to the leadframe. Other devices and methods are also disclosed.

REFERENCES:
patent: 4933741 (1990-06-01), Schroeder
patent: 4982268 (1991-01-01), Schuermann
patent: 5019941 (1991-05-01), Craft
patent: 5028741 (1991-07-01), Sanders et al.
patent: 5072283 (1991-12-01), Bolger

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