Semiconductor device manufacturing: process – Repair or restoration
Reexamination Certificate
2007-09-06
2010-02-16
Dickey, Thomas L (Department: 2893)
Semiconductor device manufacturing: process
Repair or restoration
C257S773000
Reexamination Certificate
active
07662645
ABSTRACT:
Reworking method for removing defects on integrated circuit device is disclosed. An integrated circuit is provided, which has a substrate, a conductive material layer formed in the substrate, a dielectric layer formed on the substrate, at least a contact plug embedded in the dielectric layer, and a conductive layer contacting to the contact plug formed on the dielectric layer. A defect is found in the conductive layer and the reworking method is performed, including an etch back process, a chemical mechanical polishing process, and a deposition process. The reworking method removes the prior formed conductive layer and reform a conductive layer to prevent the integrated circuit from being scraped.
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Dickey Thomas L
Hsu Winston
United Microelectronics Corp.
Yushin Nikolay
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