Reworkable thermosetting resin composition

Details Reworkable thermosetting resin composition Reworkable thermosetting resin composition

2007-12-20

2011-11-08

Dentz, Bernard (Department: 1622)

Organic compounds -- part of the class 532-570 series

Organic compounds

Heterocyclic carbon compounds containing a hetero ring...

C549S001000

Reexamination Certificate

active

08053587

ABSTRACT:
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

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