Reworkable thermoplastic encapsulant

Details Reworkable thermoplastic encapsulant Reworkable thermoplastic encapsulant

1997-12-30

2000-08-29

Potter, Roy

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257788, 257792, 257778, H01L 2328

Patent

active

061113239

ABSTRACT:
The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a thermoplastic polymer formed by ring opening polymerization of a cyclic oligomer.

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