Reworkable, thermally-conductive adhesives for electronic assemb

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B32B 516

Patent

active

061328502

ABSTRACT:
An adhesive and method for attaching a heat sink to a printing wiring assembly that provides a thermal path from electronic components on the printing wiring assembly to the heat sink. The adhesive is flexible and accommodates thermal expansion stresses and is readily reworkable. The adhesive comprises a filler material that is disposed between the heat sink and the printing wiring assembly, and an impregnant that impregnates the filler material, which impregnated filler material is cured. The filler material may comprise alumina particles that have a spherical shape. The impregnant comprises a polymer, typically selected from a group of epoxy resins and their curatives that form a flexible material when cured. In practicing the method, a heat sink is positioned adjacent to and spaced apart from a printing wiring assembly to provide an appropriate spacing between them. The periphery of the printing wiring assembly is sealed. A cavity that is formed between the heat sink and the printing wiring assembly is filled with a filler material. The filled assembly is vibrated to maximize packing density of the filler material. The filler material is then impregnated with a flexible epoxy impregnant. The impregnant is then cured to form the flexible adhesive. This produces a structure wherein the heat sink is bonded to the printed wiring assembly.

REFERENCES:
patent: 3242116 (1966-03-01), Becker et al.
patent: 3385744 (1968-05-01), Van Sciver, II
patent: 3395105 (1968-07-01), Washburn et al.
patent: 3406053 (1968-10-01), Jaenicke
patent: 3481823 (1969-12-01), Sayer et al.
patent: 3719724 (1973-03-01), Freeman
patent: 3811183 (1974-05-01), Cellig

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reworkable, thermally-conductive adhesives for electronic assemb does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reworkable, thermally-conductive adhesives for electronic assemb, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reworkable, thermally-conductive adhesives for electronic assemb will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-466258

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.