Reworkable multi-layer printed circuit board

Details Reworkable multi-layer printed circuit board Reworkable multi-layer printed circuit board

1980-03-17

1982-01-12

Gensler, Paul L.

Wave transmission lines and networks

Plural channel systems

174 685, 333 33, 333238, 361421, H01P 308

Patent

active

043108113

ABSTRACT:
A rework layer for a multi-layer printed circuit board comprised of a reference layer and a wire network containing a plurality of conductors tailored to match the impedance characteristics existing between the internal layers of the printed circuit board, wherein the conductors can be selectively terminated after fabrication of the printed circuit board.

REFERENCES:
patent: 3530411 (1970-09-01), Sear
patent: 3605063 (1971-09-01), Stewart
patent: 4047132 (1977-09-01), Krajewski
patent: 4130723 (1978-12-01), Wakeling
patent: 4202007 (1980-05-01), Dougherty et al.

Affiliated with

Also associated with

Rating

Reworkable multi-layer printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reworkable multi-layer printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reworkable multi-layer printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1543428