Reworkable microelectronic multi-chip module

Details Reworkable microelectronic multi-chip module Reworkable microelectronic multi-chip module

1998-09-19

2000-04-18

Heinrich, Samuel M.

Metal fusion bonding

Process

Using only pressure

228119, 22818022, 228191, H01L 21603

Patent

active

060504765

ABSTRACT:
A reworkable cold welded microelectronic multi-chip module contains cold welded microelectronic chips in which the chip's cold weld metal bonding pads (3) are constructed of a metal having one hardness and the corresponding cold weld metal bonding pads of the multi-chip module's substrate (5) are of a different greater hardness, which, despite the difference in hardness, cold weld to one another. Two forms of Indium preferably serve as the metals. If for any reason the chip must be removed from the module, it is found that the cold weld breaks at a predictable location. A new microelectronic chip may thereby be cold welded to the module substrate as a replacement. New rework and testing procedures are thereby made possible.

REFERENCES:
patent: 4817850 (1989-04-01), Wiener-Avnear et al.
patent: 5065933 (1991-11-01), Basavanhally
patent: 5071787 (1991-12-01), Mori et al.

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