Reworkable high density interconnect structure incorporating a r

Details Reworkable high density interconnect structure incorporating a r Reworkable high density interconnect structure incorporating a r

1994-04-11

1995-07-18

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

29846, 156289, 174259, H05K 111

Patent

active

054347513

ABSTRACT:
A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer bonding the two portions together and allowing for easy removal of the HDI structure from the substrate of the module by immersion in an appropriate solvent for the release layer.

REFERENCES:
patent: 4783695 (1988-11-01), Eichelberger
patent: 4859512 (1985-08-01), Jones et al.
patent: 4933042 (1990-06-01), Eichelberger
patent: 5073814 (1991-12-01), Cole, Jr.
patent: 5157589 (1992-10-01), Cole, Jr.
patent: 5161093 (1992-11-01), Gorczyca
IBM Technical Disclosure Bulletin "Interconnection Alignment Multichip Module" by Balderes et al. vol. 15 No. 10 Mar. 1973 (p. 3024).

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