Reworkable epoxy die-attach adhesive

Details Reworkable epoxy die-attach adhesive Reworkable epoxy die-attach adhesive

1989-09-05

1991-03-26

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428323, 428413, 428414, 428901, 206228, 206230, 528422, 525530, 525531, B32B 900

Patent

active

050028189

ABSTRACT:
An adhesive mixture reworkably adheres electronic integrated circuit dies to hybrid microcircuit substrates, and includes a thermosetting epoxy resin. A thermoplastic resin additive allows the mixture to retain the high adhesive strength of the epoxy resin up to approximately 150.degree. C., or the upper limit of the operating and testing temperature range of the dies, and then soften sufficiently to enable defective dies to be removed at a temperature of preferably between 150.degree. C. and 200.degree. C. without damage to the substrate or adjacent dies.

REFERENCES:
Epoxy Resin--Phenoxy Resin Blend, CA 110(10):77051(s), 3M (Schenz).
Polyimide Compsns Die Attach Adhesives, Mat Chem, EP Abs 89309229, Powell et al.
High Temp Elec. Cond. Ads., Mactiner et al., Sampe Conf.
Thermoplastic Films for Adh Bonding, Shore, 39th Electronic Comps. Proceedings.

Affiliated with

Also associated with

Rating

Reworkable epoxy die-attach adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reworkable epoxy die-attach adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reworkable epoxy die-attach adhesive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-616523