Reworkable encapsulated electronic assembly and method of making

Details Reworkable encapsulated electronic assembly and method of making Reworkable encapsulated electronic assembly and method of making

1993-06-11

1995-01-10

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

2940208, 174 522, 264300, 361713, 361736, H05K 720

Patent

active

053813049

ABSTRACT:
An improved encapsulant and method of application for rework of a modular electronic assembly. A housing is provided with a structure that permits deformation with thermal expansion of the encapsulant and reduces stresses applied to the electronic components therewithin. The selected encapsulant provides mechanical stability from shock and vibration, thermal conductivity to the surroundings, and freedom from deterioration of electrical performance. Critically, the encapsulant is readily excised for repair and replacement of defective components, thus allowing rework and salvage of the assembly. A potting tool is adapted for selectively refilling the housing to replace the excised portions.

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