Reworkable die attachment to heat spreader

Details Reworkable die attachment to heat spreader Reworkable die attachment to heat spreader

1994-09-21

1998-05-12

Engel, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563075, 156427, 437209, B32B 3100

Patent

active

057499888

ABSTRACT:
A silicon die, such as an integrated circuit, is reworkably bonded to a copper heat spreader. The silicon-copper bond exhibits high compliance under conditions of thermal stress even though there is a significant thermal coefficient of expansion difference between silicon and copper. A compliant adhesive is applied to the surface of one of the silicon die and the copper heat spreader and is cured. Thereafter, a thermoplastic adhesive is applied to bond the silicon die to the copper heat spreader. A composite bond is thereby produced, including a highly compliant layer and a thermoplastic layer. The die may be reworked by heating the thermoplastic adhesive until the bond begins to soften and the die is released.

REFERENCES:
patent: 4012832 (1977-03-01), Crane
patent: 4139051 (1979-02-01), Jones et al.
patent: 4769270 (1988-09-01), Nagamatsu
patent: 5086018 (1992-02-01), Conru
patent: 5093281 (1992-03-01), Eshima
patent: 5137836 (1992-08-01), Lam
patent: 5220724 (1993-06-01), Gerstner
patent: 5268048 (1993-12-01), Leibovitz et al.
patent: 5317438 (1994-05-01), Suzuki et al.

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