Reworkable compositions of oxirane(s) or...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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Details

Other Related Categories

C438S127000, C525S486000, C525S488000, C525S504000, C525S507000, C525S524000, C525S526000, C549S001000, C549S090000, C549S516000, C549S523000, C549S525000, C549S531000, C549S543000, C549S544000

Type

Reexamination Certificate

Status

active

Patent number

07012120

Description

ABSTRACT:
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

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