Reworkable compositions incorporating episulfide resins

Details Reworkable compositions incorporating episulfide resins Reworkable compositions incorporating episulfide resins

2006-09-19

2006-09-19

Feely, Michael J. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C428S413000, C438S127000, C523S435000, C525S525000, C525S535000, C528S373000, C528S377000, C528S380000, C528S403000

Reexamination Certificate

active

07108920

ABSTRACT:
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.

REFERENCES:
patent: 5355580 (1994-10-01), Tsukada
patent: 5512613 (1996-04-01), Afzali-Ardakani et al.
patent: 5560934 (1996-10-01), Afzali-Ardakani et al.
patent: 5760337 (1998-06-01), Iyer et al.
patent: 5783867 (1998-07-01), Belke, Jr. et al.
patent: 5872158 (1999-02-01), Kuczynski
patent: 5932682 (1999-08-01), Buchwalter et al.
patent: 5948922 (1999-09-01), Ober et al.
patent: 5973033 (1999-10-01), Ober et al.
patent: 2001/0047043 (2001-11-01), Okoroafor et al.
patent: 5102343 (1993-04-01), None
patent: 5251516 (1993-09-01), None
patent: 6069280 (1994-03-01), None
patent: 6077264 (1994-03-01), None
patent: 9831738 (1998-07-01), None

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