Reworkable circuit board assembly including a reworkable flip ch

Details Reworkable circuit board assembly including a reworkable flip ch Reworkable circuit board assembly including a reworkable flip ch

1997-07-08

1999-09-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361705, 361706, 361717, 361718, 361719, 257706, 165 803, H05K 720

Patent

active

059532106

ABSTRACT:
A reworkable circuit board assembly including a flip chip adapted for removal in the event of a failure and a method for fabricating the same is disclosed. The reworkable circuit board assembly includes a heat sink having a coefficient of thermal expansion substantially matched to the coefficient of thermal expansion of the flip chip. It also includes a deformable circuit board having a first side and a second side, wherein the first side is secured to a side of the heat sink in thermal communication therewith. The flip chip is bonded to the second side of the deformable circuit board without underfill or with weak bond strength underfill to facilitate removal of the flip chip in the event of a rework.

REFERENCES:
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patent: 5151388 (1992-09-01), Bakhit et al.
patent: 5268048 (1993-12-01), Leibovitz et al.
patent: 5659203 (1997-08-01), Call et al.
patent: 5685071 (1997-11-01), Gates, Jr. et al.
patent: 5723369 (1998-03-01), Barber
patent: 5757073 (1998-05-01), Hoffmeyer

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