Reworkable adhesives containing thermally labile groups

Details Reworkable adhesives containing thermally labile groups Reworkable adhesives containing thermally labile groups

2007-10-30

2007-10-30

Feely, Michael J. (Department: 1712)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S094000, C156S330000, C523S400000, C525S523000

Reexamination Certificate

active

10892462

ABSTRACT:
Embodiments of the present invention relate to adhesive compositions containing thermally-labile groups for decreasing the degradation temperature of the adhesive for reworkability of electronic components in surface mounting applications. In one embodiment, the thermally reworkable epoxy-based composition is a cured product of a multifunctional epoxide and a curing agent, the curing agent having at least one thermally-labile group. Upon heating the thermally reworkable epoxy-based composition above a desired trigger temperature, the thermally-labile group decomposes thereby effecting depolymerization in the network. Consequently, the physical properties (e.g., shear strength) of the adhesive network are severely degraded thereby enabling easy removal of the device. In another embodiment, a thermally reworkable epoxy-based composition is a cured product of an epoxide having at least one thermally-labile group and a curing agent having at least one thermally-labile group.

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