Reworkable adhesive for electronic applications

Details Reworkable adhesive for electronic applications Reworkable adhesive for electronic applications

1993-12-13

1995-10-10

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525 58, 525107, 525113, 525403, 525407, 525410, 525420, 525423, 525437, 525438, 525463, 525467, 525504, 525507, 525534, C08L 8106, C08L 2914, C08L 6302

Patent

active

054571499

ABSTRACT:
Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing temperature.

REFERENCES:
patent: 3530087 (1970-09-01), Hayes et al.
patent: 3595000 (1971-07-01), Recker
patent: 3678131 (1972-07-01), Klapprott et al.
patent: 3733349 (1973-05-01), Loudas et al.
patent: 3798105 (1974-03-01), Hanna et al.
patent: 3962184 (1976-06-01), Notomi et al.
patent: 4022755 (1977-05-01), Tanigaichi et al.
patent: 4026913 (1977-05-01), Tanigaichi et al.
patent: 4116946 (1978-09-01), Jakob et al.
patent: 4195132 (1980-03-01), Sundermann et al.
patent: 4331582 (1982-05-01), Babayan
patent: 4414366 (1983-11-01), Wu et al.
patent: 4503211 (1985-03-01), Robins
patent: 4528366 (1985-07-01), Woo et al.
patent: 4606962 (1986-08-01), Reylek et al.
patent: 4645805 (1987-02-01), Gaku et al.
patent: 4661559 (1987-04-01), Gardner et al.
patent: 4677144 (1987-06-01), Yasuda et al.
patent: 4680226 (1987-07-01), Takeda
patent: 4684678 (1987-08-01), Schultz et al.
patent: 4693770 (1987-09-01), Hatada
patent: 4696764 (1987-09-01), Yamazaki
patent: 4707534 (1987-11-01), Schultz
patent: 4709008 (1987-11-01), Shimp
patent: 4717609 (1988-01-01), Gaku et al.
patent: 4735847 (1988-04-01), Fujiwara et al.
patent: 4739019 (1988-04-01), Schappert et al.
patent: 4740584 (1988-04-01), Shimp
patent: 4749120 (1988-06-01), Hatada
patent: 4759970 (1988-07-01), Seeger, Jr. et al.
patent: 4769399 (1988-09-01), Schenz
patent: 4804740 (1989-02-01), Gardner et al.
patent: 4814040 (1989-03-01), Ozawa
patent: 4820446 (1989-04-01), Prud'Homme
patent: 4822683 (1989-04-01), Schappert et al.
patent: 4868288 (1989-09-01), Meier
patent: 4902752 (1990-02-01), Shimp
patent: 5002818 (1991-03-01), Licari et al.
Kirk-Othmer, Encyclopedia of Chemical Technology, vol. 18 pp. 605-610.
Raghava, "Role of Matrix-Particle Interface Adhesion on Fracture Toughness of Dual Phase Epoxy-Polyethersulfone Blend", Journal of Polymer Science/Part B: Polymer Physics, vol. 25, May 1987.
E. Grigat et al., Agnew. Chem. Internat. Edit., 6, 206 (1967).
F. A. Hudock et al., technical paper presented at the IPC Fall Meeting Sep. 21-25, 1986.
K. Hatada, et al., Proceedings of the 5th IEEE/CHMT International Electronic Manufacturing Technology Symposium--Design-to-Manufacturing Transfer Cycle, Oct. 10-12, 1988, pp. 23-27, "Micron Bump Bonding Assembly Technology".
"AroCy.TM. B-40S Cyanate Ester Resin Solution" product brochure, Oct. 1988.
"AroCy.TM. T-30 Cyanate Ester Semisolid Resin" technical information brochure, Oct. 1988.
"RTX 366 Developmental Cyanate Ester Monomer" technical brochure.
"AcroCy.TM. M-30 Cyanate Ester Semisolid Resin" technical information brochure.
M. Masuda, et al., Proceedings of the 1989 Japan IEMT Symposium, 6th IEEE/CHMT International Electronic Manufacturing Technology Symposium, Apr. 26-28, 1989, pp. 55-58, entitled "Chip on Glass Technology for Large Capacity and High Resolution LCD".
K. K. T. Chumg, et al., Connection Technology Nov. 1989, pp. 37-39.
M. F. Hawthorne, J. Org. Chem., 22, 1001 (1957).
D. Martin and M. Bauer, Org. Synth., 61, 35-38 (1983).
W. E. Parham and E. L. Anderson, J. Am Chem. Soc., 70, 4187 (1948).
J. Cromyn, Structural Adhesives, edited by A. J. Kinloch (Elsevier Applied Science Publishers, 1986), pp. 269-312.
U.S.Ser. No. 234,464, "Energy-Curable Cyanate Compositions", filed Aug. 19, 1988.
R. R. Tummala and E. J. Rymaszewski, Microelectronics Packaging Handbook, (Van Nostrand Reinhold, 1989), pp. 280-309; 366-391.
K. Nakamura, Nikkei Microdevices, Jun. 1987.
R. S. Bauer, "Toughened High Performance Epoxy Resins: Modification with Thermoplastics", 34th International SAMPE Symposium, May 8-11, 1989.
P. B. Hogerton, et al., "Investigations Into the Use of Adhesives for Level-1 Microelectronic Interconnections", Electronic Packaging Materials Science, Symposium Proceedings, Apr. 24.gtoreq.29, 1989.

Affiliated with

Also associated with

Rating

Reworkable adhesive for electronic applications does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reworkable adhesive for electronic applications, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reworkable adhesive for electronic applications will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2310805