Rework process for semiconductor chips mounted in a flip chip co

Details Rework process for semiconductor chips mounted in a flip chip co Rework process for semiconductor chips mounted in a flip chip co

1995-02-24

1996-08-06

Heinrich, Samuel M.

Metal fusion bonding

Process

Repairing, restoring, or renewing product for reuse

228254, 228264, H05K 334

Patent

active

055426018

ABSTRACT:
A new rework process for semiconductor chips mounted in a flip chip configuration, via solder balls, on an organic substrate is disclosed.

REFERENCES:
patent: 3731866 (1973-05-01), Mason et al.
patent: 4416408 (1983-11-01), Spirig
patent: 4832249 (1989-05-01), Ehler
patent: 5072874 (1991-12-01), Bertram et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5284286 (1994-02-01), Brofman et al.
patent: 5392980 (1995-02-01), Swamy et al.
IBM Technical Disclosure Bulletin, "Replacement Pads for SMT Components on Printed Circuit Boards", vol. 33, No. 3A, pp. 213-214, Aug.,1990.
IBM Technical Disclosure Bulletin vol. 16, No. 4, Sep. 9, 1973, "Accurate Chip Placement on a Substrate", p. 1154, by DeBoskey et al.
IBM TDB vol. 24, No. 7A, Dec. 1981, "Use of a Tinned Copper Slug for Module Reworking", p. 3481, by Le Pape.
IBM TDB vol. 27, No. 12, May 1985, "Laser Individual Chip Rework System", p. 7110, by Druschel et al.

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