Reversible top/bottom MEMS package

Details Reversible top/bottom MEMS package Reversible top/bottom MEMS package

2009-03-04

2011-10-04

Cao, Phat X (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S659000, C257S680000

Reexamination Certificate

active

08030722

ABSTRACT:
A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. A cover substrate having a plurality of metal traces and a plurality of cover vias is provided. A first die is attached to the first surface of the substrate and positioned over the opening. Side members are coupled to ground planes on the base substrate and cover substrate to form an RF shield around the first die. At least one wirebond having a first end attached to the first die and a second end attached to a metal trace of the base substrate is provided. The at least one wirebond forms a loop wherein a top section of the loop contacts a metal trace of the cover substrate.

REFERENCES:
patent: 6522762 (2003-02-01), Mullenborn et al.
patent: 7166910 (2007-01-01), Minervini
patent: 7202552 (2007-04-01), Zhe et al.
patent: 7242089 (2007-07-01), Minervini
patent: 2006/0157841 (2006-07-01), Minervini
patent: 2007/0018334 (2007-01-01), Peytavy et al.
patent: 2007/0201715 (2007-08-01), Minervini
patent: 2008/0150095 (2008-06-01), Yang et al.
patent: 2009/0218668 (2009-09-01), Zhe et al.

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