Reversible attachment using dielectric heating

Details Reversible attachment using dielectric heating Reversible attachment using dielectric heating

1995-10-17

1999-02-02

Davis, Jenna

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With means applying wave energy or electrical energy...

1563797, 428349, B32B 3500

Patent

active

058659404

ABSTRACT:
The present invention relates to a method of removably adhering a non-conductive member to a conductive member comprising the steps of placing an electrode on the non-conductive member. The electrode overlies matting surfaces of the conductive and non-conductive members. A reheatable adhesive is applied between matting surfaces of the conductive and non-conductive members and a high frequency electric field is applied between said electrode and said conductive member sufficient to cure the adhesive. The non-conductive member may be removed from the conductive member by applying a high frequency electric field between the electrode and said conductive member sufficient to soften the adhesive and removing the non-conductive member from the conductive member.

REFERENCES:
patent: 3574031 (1971-04-01), Heller
patent: 4749833 (1988-06-01), Novorsky

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