Reverse method of applying heat activated ornamental transfer

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156267, 1563096, 156293, 428139, B32B 3100, B32B 3120

Patent

active

049716441

ABSTRACT:
A method of applying a heat activated ornamental transfer to a foraminous substrate such as a mesh shirt employs an absorbent layer to absorb portions of the transfer which cover holes in the foraminous surface. The heat activated transfer is positioned on the substrate with an absorbent material underneath the substrate. Heat and pressure is applied to the heat activated transfer causing it to bond to the foraminous substrate. This same heat and pressure also causes that portion of the transfer covering holes to bond to the absorbent material beneath the substrate. While still warm, the absorbent material is separated from the material pulling with it the portions of the transfer which cover holes. This leaves the holes clear providing an extremely pleasant aesthetic appearance.

REFERENCES:
patent: 3660212 (1972-05-01), Liebe, Jr.
patent: 4066802 (1978-01-01), Clemens
patent: 4269885 (1981-05-01), Mahn
patent: 4390387 (1983-06-01), Mahn
patent: 4610904 (1986-09-01), Mahn, Sr. et al.
patent: 4786349 (1988-11-01), Mahn, Sr.
patent: 4842908 (1989-06-01), Cohen et al.

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