Reverse current gold etch

Details Reverse current gold etch Reverse current gold etch

1998-06-23

2000-11-21

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

438745, 438754, C23F 100

Patent

active

061502790

ABSTRACT:
A method and apparatus for gold etching in semiconductor circuit manufacturing. An environmentally safe etching solution is used in an electroplating device to etch gold from a semiconductor substrate. The etching solution is free of iodine and cyanide based compounds and preferably includes thiourea.

REFERENCES:
patent: 4537663 (1985-08-01), Macdonald
patent: 5145552 (1992-09-01), Yoshizawa et al.
patent: 5221421 (1993-06-01), Leibovitz et al.
patent: 5406318 (1995-04-01), Moore et al.
patent: 5900160 (1999-05-01), Whitesides et al.

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