Reverse current gold etch

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438745, 438754, C23F 100

Patent

active

061502790

ABSTRACT:
A method and apparatus for gold etching in semiconductor circuit manufacturing. An environmentally safe etching solution is used in an electroplating device to etch gold from a semiconductor substrate. The etching solution is free of iodine and cyanide based compounds and preferably includes thiourea.

REFERENCES:
patent: 4537663 (1985-08-01), Macdonald
patent: 5145552 (1992-09-01), Yoshizawa et al.
patent: 5221421 (1993-06-01), Leibovitz et al.
patent: 5406318 (1995-04-01), Moore et al.
patent: 5900160 (1999-05-01), Whitesides et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reverse current gold etch does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reverse current gold etch, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reverse current gold etch will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1256855

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.