Reusable package for holding a semiconductor chip and method for

Details Reusable package for holding a semiconductor chip and method for Reusable package for holding a semiconductor chip and method for

1990-09-17

1991-08-20

Chaudhuri, Olin

Fishing, trapping, and vermin destroying

206328, 174 524, 437923, H01L 2336

Patent

active

050413961

ABSTRACT:
A reusable semiconductor package such as a ceramic pin grid array package is described. The package includes a housing having a bottom wall for supporting a semiconductor die. The housing defines therein a cavity which is open at the top and which communicates with the environment through a hole in the bottom wall. A disposable base suitable for supporting a semiconductor chip is adapted to be placed on top of the bottom wall. The base covers the hole entirely when it is used to support the chip. The base is then sealingly attached to the housing in a manner that it can be removed from the housing without any substantial damage to the housing. When the package is to be reused for a different chip, the base can be easily removed by applying a force through the hole through the bottom wall. The original die and base may be simply disposed and a new die on a new base be put in their place.

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