Reusable carrier for burn-in/testing on non packaged die

Details Reusable carrier for burn-in/testing on non packaged die Reusable carrier for burn-in/testing on non packaged die

1993-11-05

1996-11-05

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 3102

Patent

active

055721400

ABSTRACT:
A re-usable carrier having a cavity for receiving unpackaged die with molded metallized probe heads to establish contact with the bond pads of the die, enabling the die to be functionally tested through the existing test systems. The novel carrier has metallized contacts for making electrical connection between the bare die and the perimeter of the carrier. The circuitry for electrically connecting the die and the perimeter of the carrier can be molded and plated into the base or printed on polymeric film. The base or integrated cover-base of the carrier may be from injection or press molded thermoplastic or press molded from ceramic to conform to any intended package for the die. The object is to adapt the carrier to the existing test equipment for burn-in stress and electrical tests for the intended package design without having to modify the hardware. The carrier may be plugged into a burn-in socket for burn-in stress testing and inserted onto an automatic test handler for electrical testing. Following burn-in stress and electrical tests, the die is removed and the carrier may be re-used.

REFERENCES:
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patent: 5414372 (1995-05-01), Levy
Capp, Arthur O. "Pure Copper Circuit on Ceramic Substrate Process" Hybrid Circuit Technology, Nov. 1990.

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