Retort for gas diffusion bonding of metals under vacuum

Metal fusion bonding – Process – Diffusion type

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228190, 2282351, B23K 2000

Patent

active

052537960

ABSTRACT:
A retort for use in diffusion bonding preselected areas of a stack of metallic sheets during a process of fabricating metallic sandwich structures. The retort facilitates a contamination-free, evacuated environment in which a plurality of sheets of titanium aluminide can be joined to one another at selected areas to form a pack. The process of joining embraces a technique of elevated temperature gas diffusion bonding. Subsequent superplastic expansion of the bonded blanks is employed to form desired sandwich structures.

REFERENCES:
patent: 3015885 (1962-01-01), McEuen
patent: 3186083 (1965-06-01), Wright
patent: 3345735 (1967-10-01), Nicholls
patent: 4087037 (1978-05-01), Schier
patent: 4526312 (1985-07-01), Goss
patent: 4916027 (1990-04-01), DelMundo
patent: 5024368 (1991-06-01), Bottomley

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Retort for gas diffusion bonding of metals under vacuum does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Retort for gas diffusion bonding of metals under vacuum, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Retort for gas diffusion bonding of metals under vacuum will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1346345

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.