Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask
Reexamination Certificate
2007-06-12
2007-06-12
Rosasco, S. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Radiation modifying product or process of making
Radiation mask
C430S394000
Reexamination Certificate
active
10919059
ABSTRACT:
Reticles having reticle patterns suitable for reducing edge of array effects are provided. The reticle patterns have unresolvable patterns formed in the periphery areas of the reticle patterns. The unresolvable patterns are non-transparent with respect to patterning radiation. Systems incorporating the reticles are also provided. Additionally, methods of forming and using the reticles are provided.
REFERENCES:
patent: 5258920 (1993-11-01), Haller et al.
patent: 5429896 (1995-07-01), Hasegawa et al.
patent: 5429897 (1995-07-01), Yoshioka et al.
patent: 5446521 (1995-08-01), Hainsey et al.
patent: 5707765 (1998-01-01), Chen
patent: 5786114 (1998-07-01), Hashimoto
patent: 5821014 (1998-10-01), Chen et al.
patent: 5881125 (1999-03-01), Dao
patent: 6255024 (2001-07-01), Pierrat
patent: 6451488 (2002-09-01), Rhodes
patent: 6667791 (2003-12-01), Sanford et al.
patent: 6818359 (2004-11-01), Burgess et al.
patent: 6846595 (2005-01-01), Smith
patent: 2001/0005619 (2001-06-01), Hasebe et al.
patent: 2002/0045106 (2002-04-01), Baselmans et al.
patent: 2002/0045136 (2002-04-01), Fritze et al.
Baggenstoss William J.
Burgess Byron N.
Byers Erik
Stanton William A.
Dinsmore & Shohl LLP
Micro)n Technology, Inc.
Rosasco S.
LandOfFree
Reticles and methods of forming and using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reticles and methods of forming and using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reticles and methods of forming and using the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3828359