Reticle, semiconductor die and method of manufacturing...

Details Reticle, semiconductor die and method of manufacturing... Reticle, semiconductor die and method of manufacturing...

2008-03-25

2008-03-25

Young, Christopher G. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

C430S022000, C430S030000, C430S312000, C438S014000, C438S018000, C438S401000, C716S030000

Reexamination Certificate

active

07348109

ABSTRACT:
The invention is directed to increasing the number of semiconductor dice obtained from one semiconductor wafer and enhancing the reliability and yield of the semiconductor dice when the semiconductor dice as products and TEG dice are formed on the semiconductor wafer. TEG die pattern regions are respectively placed on the top and bottom placing a plurality of semiconductor die pattern regions regularly arrayed in a longitudinal direction therebetween. The vertical length of each of the TEG die pattern regions is substantially half of the vertical length of the semiconductor die pattern region. With this reticle, two adjacent TEG die patterns respectively formed by two continuous exposure processes form the area of one semiconductor die pattern. In this manner, the area of the TEG die patterns on the semiconductor wafer is reduced and the yield of the semiconductor dice is increased correspondingly.

REFERENCES:
patent: 6492189 (2002-12-01), Yamaguchi
patent: 7207028 (2007-04-01), Inoue
patent: 7219422 (2007-05-01), Wada et al.
patent: 2005-283609 (2005-10-01), None

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