Reticle assembly, system, and method for using the same

Details Reticle assembly, system, and method for using the same Reticle assembly, system, and method for using the same

1986-06-30

1987-10-27

Hayes, Monroe H.

Photocopying

Projection printing and copying cameras

Step and repeat

355 54, G03B 2742

Patent

active

047025921

ABSTRACT:
A reticle assembly, exposure system, and method for exposing each of a plurality of levels of a single die or device dies of a semiconductor wafer to a pattern of radiation on a site-by-site exposure basis are disclosed. Radiation patterning means between a source of radiation and the semiconductor wafer pattern the radiation onto the semiconductor wafer and a stepping means incrementally moves the semiconductor wafer relative to the patterning means for exposing the device dies, one at a time, in succession. The patterning means includes a reticle assembly having a plurality of reticles arranged in a coplanar array with each reticle having a respective different die exposure pattern.

REFERENCES:
patent: 4128331 (1978-12-01), Nakamura
patent: 4573791 (1986-03-01), Phillips
patent: 4613230 (1986-09-01), Iwai
patent: 4620785 (1986-11-01), Suzuki et al.

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