Reticle, and method of laying out wirings and vias

Details Reticle, and method of laying out wirings and vias Reticle, and method of laying out wirings and vias

2011-07-19

2011-07-19

Huff, Mark F (Department: 1721)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

C430S311000, C430S394000

Reexamination Certificate

active

07981574

ABSTRACT:
Provided is a reticle used for forming a plurality of vias for connecting first wirings provided in a first wiring layer and second wirings provided in a second wiring layer formed above the first wiring layer. The first wirings and the second wirings are provided along one of a first direction and a second direction, and the first direction and the second direction perpendicularly cross each other. The reticle includes a plurality of via opening patterns for forming the plurality of vias. Each of the plurality of via opening patterns has a rectangular shape, and is arranged to cause each side of each of the via opening patterns to be diagonal with respect to the first direction and the second direction.

REFERENCES:
patent: 7023094 (2006-04-01), Suga
patent: 7365431 (2008-04-01), Matsubara
patent: 2002/0162079 (2002-10-01), Igarashi et al.
patent: 2004/0262640 (2004-12-01), Suga
patent: 2005/0179134 (2005-08-01), Matsubara
patent: 2006/0118966 (2006-06-01), Suga
patent: 2007/0011638 (2007-01-01), Watanabe et al.
patent: 2005-19604 (2005-01-01), None
patent: 2005-268748 (2005-09-01), None

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