Reticle alignment procedure

Details Reticle alignment procedure Reticle alignment procedure

2005-08-30

2005-08-30

Young, Christopher G. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

C430S030000, C356S399000, C356S401000

Reexamination Certificate

active

06936386

ABSTRACT:
A semiconductor wafer has at least one pre-layer on-wafer alignment mark (pre-layer on-wafer AM) on a top surface of the semiconductor wafer. A baseline check (BCHK) is performed to align a current-layer reticle AM on a current-layer reticle with the pre-layer on-wafer AM. By capturing and comparing signals of the current-layer reticle AM and the pre-layer on-wafer AM, a corresponding coordinate of the current-layer reticle to the semiconductor wafer is calibrated. Finally, a lithography process is performed to transfer the layout of the current-layer reticle AM to the top surface of the semiconductor wafer to form a corresponding current-layer on-wafer AM.

REFERENCES:
patent: 5942357 (1999-08-01), Ota

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